8 zones reflow oven with guide rail ET-R8
Reflow soldering process requirements
Reflow soldering technology is no stranger to the electronics manufacturing industry. The components on the various boards used in our computers are soldered to the board by this process. The advantage of this process is that the temperature is easy to control, oxidation is avoided during the welding process, and manufacturing costs are easier to control. The inside of the device has a heating circuit that heats the nitrogen gas to a sufficiently high temperature and blows it to the circuit board on which the component has been attached, so that the solder on both sides of the component melts and bonds to the main board.
1. Full computer control
2. Full computer control
3. 4900mm length, 1270mm width, 1450mm height with 1800 kg
4. ±1℃Temp. Accuracy
5.Up 8 heating Zones, down 8 heating zones, 2 cooling zone
6.Apply solder paste type:Lead-free solder/Ordinary solder
7.Heat up time no more than 25 min
8.±2℃PCB Temp. Deviation
1. Windows-XP operation interface, designed two kinds of control mode, computer control and emergency manual control, have the functions of security.
2. Cover the heating zones can be automatically opened, easy to maintain, equipped with open end safety device
3. Unique furnaces are the wind structure within different areas of the furnace can be different wind speed difference arising due to structure adjustment, heat uniform.
Set up in :
Pick and place machine
More than 20 countries
Our company sells many types of smt machine, please contact us if you are interested.
Add: 44th.Building,5th.Cuigang Industrial Area, Fuyong, Baoan District, Shenzhen,China