ET-R5 Small Size Reflow Oven
The advantage of reflow oven
Reflow soldering technology is no stranger to electronics manufacturing. The components on the various boards used in our computers are soldered to the board by this process. The inside of the device has a heating circuit that uses air or nitrogen. After heating to a high enough temperature, blow to the board that has been attached to the component, so that the solder on both sides of the component melts and sticks to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation is avoided during the welding process, and manufacturing costs are easier to control.
Heating Zone: Top 5 / Bottom 5
Heating Passage: 1800mm
Heating Style: Hot air
Cooling zone: one zone
PCB Max Width: 300mm
Conveyor direction: Left-Right(R-L optional)
Process height: 880±20mm
Conveyor Style: mesh belt
Conveyor speed: 0-1500mm/min
Power: 5 lines 3 phase AC 380V 50/60Hz
Ramp up time: aprrox 15mins
Temperature set-point Room temerature to 400°C
Temperature control:PID Tenmperatem closed loop control
Deviation temperature on pcb:±2°C
Abnormal alarm:equipped temperature abnormal alarm device
We offer a standard one-year warranty, and any replacement of parts will be free during the repair period, and we will install and commission free of charge, and visit customers regularly.
We provide complete sales service, this includes a range of guaranteed services including pre-sales preparation, in-sale product introduction, after-sales product installation and commissioning, and maintenance.
Add: 44th.Building,5th.Cuigang Industrial Area, Fuyong, Baoan District, Shenzhen,China