pick and place Machine High Efficienc Full-automatic

1.HT-T7 placement machine,led light making machine 2.HT-T7 led machine light Producing with 2~4 types of materials with high capacity,available for 5m,50m or any length of flexible strip and roll to roll. 3.HT-T7 SMT led light machine Two modules ,15 nozzles ,for each mounting part ,part A or part B can be mounted separatly or synchronously. Calibration automatically,high precision,available for RGB. Exclusive patent technology :group to pick and group to mount.

Product Details

led light pick and place machine,for flexible strip light


Product presentation

1.Soft lamp tape special high-speed mounter

2.High Precision: Five sets of imported cameras are equipped with visual alignment, mark correction technology and optical positioning technology to accurately identify the position of PCB board and quickly and accurately mount components.

3.High Speed: Applying the exclusive patented technology of group-based and group-based pasting, the pasting speed is 100000-150000 CPH, 60 feeders station and 30 nozzles. It can automatically transmit on-line. And It can produce 2-4 kinds of materials at the same time, which greatly improves the efficiency.

4.Strong durability: The quality of hardware equipment is guaranteed by certificate, the quality of dual motor electronic flying and guide rail and screw is guaranteed, which can support 24-hour operation.

5.Simple operation: Windows 7 system can be used to switch the Chinese-English interface, usually 3 to 5 days training of operation is enough.

6.Components:LED 3014/3020/3528/5050 and resistors,capacitors,bridge rectifiers.


Features

led light making machine Producing with 2~4 types of materials with high capacity,available for 5m,50m or any length of flexible strip and roll to roll.

HT-T7 placement machine with Two modules ,15 nozzles ,for each mounting part ,part A or part B can be mounted separatly or synchronously.Calibration automatically,high precision,available for RGB.

Exclusive patent technology :group to pick and group to mount.

SMT flexible  strip placement machine

Technical parameter


HT-T7
PCBPCB length width250mm*any length
PCB thickness0.5~1.5mm
PCB clampingAdjustable pressure pneumatic
Mounting modeGroup to take and group to mount
O.S.systemWindows 7
softwareR&D independently
displayLED monitor
Input deviceKeyboard , mouse

Vision

system

No.of camera

5 sets of imported camera

Vision alignment,mark correction

Mounting precision0.02mm(repeat precision)
Mounting height<15mm
Mounting speed100000~150000CPH
ComponentsLED 3014/3020/3528/5050 and resistors,capacitors ,bridge rectifiers.
Components space0.2mm
No.of feeders station60PCS
No.of nozzles30PCS
Power220AC 50HZ
Power consumption5KW
Transmission speed>500mm/sec
Transmission directionSingle (left to right or right or left)
Position modeOptical
X,Y,X axis drive wayServo motor control for X,Y,Z axis
Feeding wayElectric feeder with double motor


The surface mount assembly 

The surface mount assembly process mainly includes the following steps: solder paste printing, component mount, and reflow soldering. The steps are summarized as follows:

Stencil Printing: solder paste is a follow-up material for the surface adhesive components and PCB to connect with each other. First, the steel plate is etched or laser cut, and then the solder paste is printed on the welding pad of PCB by the squeegee of the Printing machine, so as to enter the next step.

Component Placement: Component Placement is the key technology and work focus of the entire SMT process. The process USES highly precise automatic mounting equipment to accurately place the surface mount components on the solder pad of the printed PCB through computer programming.As the design of surface adhesive components is becoming more and more precise, the distance between the joints is becoming smaller, so the technical level difficulty of placement operation is increasing day by day.

Reflow Soldering,(Reflow Soldering) : Reflow Soldering is to have been placed on the surface of adhesive components of the PCB, after Reflow furnace first preheating with activated flux, to raise its temperature to 217 ℃ melt solder paste, feet and PCB Soldering pad connected components, then after cooling, cooling, make the solder curing, surface adhesive components and PCB bonding is completed.


Packaging & Shipping

Our mode of transportation including water, land and air transportation.You can choose the most suitable way according to your requirements.

Our packing is made of wooden box with vacuum package, and we promise to deliver the goods within four weeks after payment.


Remarks

1.Payment terms: Deposit 30% in advance,the balance 70% should be paid before shipment by T/T.

2.Delivery time: 30 days after deposit.

3.Warranty: 1 year.(including spare parts)


Company Information

ETON advanced technology and innovation drives the revolution of market rapidly,and obtains a number of intellectual property technologies,including 9 invention patents,112 practical patents ,12 software copyrights,which save much labors and space of production,got large market share in USA ,KOREA,INDIA,GERMANY,EGYPT,TURKEY,VIETNAM,TUNISIA,THAILAND more than 20 countries.

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