The reflow soldering function is to feed the circuit board on which the chip component is mounted into the SMT reflow soldering pad, and the solder paste used for soldering the chip component is melted by a high temperature hot air to form a reflow temperature change process at a high temperature, so that the chip component and the chip component are The pads on the board are bonded and then cooled together.
Reflow soldering is a very popular production process for SMT technology. Reflow soldering is mainly used for the soldering of surface mount components and printed boards. By re-melting the paste solder pre-dispensed onto the printed circuit board pads, the surface mount components are soldered or pinned and printed. The mechanical and electrical connection between the board pads is soldered to achieve a reliable circuit function.