1, solder paste printing
Its function is to use a scraper to print the solder paste at a 45-degree angle to the pad of the PCB to prepare for the soldering of the components. The equipment used is a printing press (solder paste press) at the forefront of the SMT line.
2, part placement
Its role is to accurately mount the surface-mounted components to a fixed position on the PCB. The equipment used is a placement machine, which is located behind the printing machine in the SMT production line. Generally, the high-speed machine and the general-purpose machine are used in accordance with production requirements.
3, reflow soldering
Its function is to melt the solder paste and firmly solder the surface-assembled components to the PCB. The equipment used is a reflow oven, which is located behind the placement machine in the SMT production line. The temperature requirements are quite strict, and the temperature measurement needs to be performed in real time. The measured temperature is expressed in the form of a prof