Solder Paste Printing --> Part Placement --> Reflow Soldering --> AOI Optical Inspection --> Maintenance --> Sub-board.
The pursuit of miniaturization of electronic products has not been able to reduce the number of perforated plug-in components previously used. Electronic products are more complete, and the integrated circuits (ICs) used have no perforated components, especially large-scale, highly integrated ICs, which have to use surface mount components. Product batching, production automation, the factory must produce high-quality products at low cost and high yield to meet customer needs and enhance market competitiveness. The development of electronic components, the development of integrated circuits (IC), and the diversified application of semiconductor materials. The electronic science and technology revolution is imperative, chasing the international trend. It is conceivable that in the case of intel, amd and other international cpu, the production process of image processing device manufacturers are refined to 20 nanometers, the development of surface assembly technology and process of smt is also a situation that cannot be taken for granted.
Advantages of smt patch processing: high assembly density, small size and light weight of electronic products. The size and weight of patch components are only about 1/10 of that of traditional plug-in components. After SMT is generally used, the volume of electronic products is reduced by 40%~60. %, weight loss 60% ~ 80%. High reliability and strong anti-vibration ability. The solder joint defect rate is low. High frequency characteristics are good. Reduced electromagnetic and radio frequency interference. Easy to automate and increase productivity. Reduce costs by 30% to 50%. Save materials, energy, equipment, manpower, time, etc.