Knowleage Of SMT

- Jan 11, 2019-

First, single-sided assembly


Incoming material inspection => screen printing solder paste (point patch adhesive) => patch => drying (curing) => reflow soldering =>


Cleaning => Detection => Repair


Second, double-sided assembly


A: incoming material inspection => PCB A-side silk screen solder paste (point patch adhesive) => patch => drying (curing) =>


A-side reflow soldering => cleaning => flap => PCB B-side silk screen solder paste (point patch adhesive) => patch =>


Drying => reflow soldering (preferably only for side B => cleaning => inspection => rework)


This process is suitable for use when a large SMD such as PLCC is attached to both sides of the PCB.


B: incoming material inspection => PCB A-side silk screen solder paste (point patch adhesive) => patch => drying (curing) =>


A-side reflow soldering => cleaning => flap => PCB B-side patch adhesive => patch => cure =>


B-face wave soldering => cleaning => detection => rework)


This process is suitable for reflow soldering on the A side of the PCB and B wave soldering on the B side. This process should be used in SMDs assembled on the B side of the PCB only when the SOT or SOIC (28) pins are below.

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