SMT patch processing flow

- Jan 05, 2021-

1. Solder paste printing: Its function is to print the solder-free paste on the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine, located at the forefront of the SMT production line.

 

2. Part placement: Its function is to accurately install surface mount components to a fixed position on the PCB. The equipment used is a placement machine, located behind the screen printing machine in the SMT production line.

 

3. Oven curing: Its function is to melt the patch glue, so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a curing oven, located behind the placement machine in the SMT production line.

 

4. Reflow soldering: Its function is to melt the solder paste, so that the surface mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven, located behind the placement machine in the SMT production line.

 

5. Repair: its function is to repair the PCB board that has failed. The tools used are soldering iron, rework station, etc. Configured after AOI optical inspection.


image